Method for manufacturing semiconductor package for warpage control

ABSTRACT

A method for manufacturing a semiconductor package includes following operations. A die having a first surface and a second surface opposite to the first surface is provided. A polymeric film is disposed over the second surface of the die. An adhesive film is provided. The die and the polymeric film are attached to a carrier substrate through the adhesive film. The die, the polymeric film and the adhesive film are molded with a molding compound. The polymeric film is sandwiched between the die and the adhesive film upon attaching to the carrier substrate.

PRIORITY DATA

This patent is a divisional application of U.S. patent application Ser.No. 15/901,355 filed on Feb. 21, 2018, entitled of “SEMICONDUCTORPACKAGE AND METHOD FOR MANUFACTURING THE SAME”, which claims the benefitof U.S. Provisional Patent Application Ser. No. 62/590,950 filed Nov.27, 2017, the entire disclosure of which is hereby incorporated byreference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment. Semiconductor devices are typically fabricated bysequentially depositing insulating or dielectric layers, conductivelayers, and semiconductive layers over a semiconductor substrate, andpatterning the various material layers using lithography to form circuitcomponents and elements thereon. As the semiconductor industry continuesto improve the integration density of various electronic components(e.g., transistors, diodes, resistors, capacitors, etc.) by continualreduction of minimum feature size, more components are allowed to beintegrated into a given chip area.

These integration improvements are essentially two-dimensional (2D) innature, in that the volume occupied by the integrated components isessentially on the surface of the semiconductor wafer. Although dramaticimprovements in lithography have resulted in considerable improvementsin 2D integrated circuit formation, there are physical limitations tothe density that can be achieved in two dimensions. One of theselimitations is the minimum size needed to make these components. Also,when more devices are put into one chip, more complex designs arerequired.

Three-dimensional integrated circuits (3DICs) were thus formed, whereintwo dies or packages may be stacked, with through vias formed in one ofthe dies or packages to connect the other die to another substrate.Package on Package (PoP) is becoming an increasingly popular integratedcircuit packaging technique because it allows for higher densityelectronics.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a schematic cross sectional view of a semiconductor structureaccording to aspects of the present disclosure.

FIG. 2 is a flow chart representing a method for manufacturing asemiconductor package according to aspects of the present disclosure.

FIGS. 3A through 3G illustrate sectional views of a semiconductorpackage at various fabrication stages constructed according to aspectsof the present disclosure in one or more embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of elements and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper”, “on” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

As used herein, the terms such as “first”, “second” and “third” describevarious elements, components, regions, layers and/or sections, theseelements, components, regions, layers and/or sections should not belimited by these terms. These terms may be only used to distinguish oneelement, component, region, layer or section from another. The termssuch as “first”, “second” and “third” when used herein do not imply asequence or order unless clearly indicated by the context.

As used herein, the terms “approximately,” “substantially,”“substantial” and “about” are used to describe and account for smallvariations. When used in conjunction with an event or circumstance, theterms can refer to instances in which the event or circumstance occursprecisely as well as instances in which the event or circumstance occursto a close approximation. For example, when used in conjunction with anumerical value, the terms can refer to a range of variation of lessthan or equal to ±10% of that numerical value, such as less than orequal to ±5%, less than or equal to ±4%, less than or equal to ±3%, lessthan or equal to ±2%, less than or equal to ±1%, less than or equal to±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. Forexample, two numerical values can be deemed to be “substantially” thesame or equal if a difference between the values is less than or equalto ±10% of an average of the values, such as less than or equal to ±5%,less than or equal to ±4%, less than or equal to ±3%, less than or equalto ±2%, less than or equal to ±1%, less than or equal to ±0.5%, lessthan or equal to ±0.1%, or less than or equal to ±0.05%. For example,“substantially” parallel can refer to a range of angular variationrelative to 0° that is less than or equal to +10°, such as less than orequal to ±5°, less than or equal to ±4°, less than or equal to ±3°, lessthan or equal to ±2°, less than or equal to ±1°, less than or equal to±0.5°, less than or equal to +0.1°, or less than or equal to +0.05°. Forexample, “substantially” perpendicular can refer to a range of angularvariation relative to 90° that is less than or equal to ±10°, such asless than or equal to ±5°, less than or equal to ±4°, less than or equalto ±3°, less than or equal to +2°, less than or equal to +1°, less thanor equal to +0.5°, less than or equal to ±0.1°, or less than or equal to±0.05°.

Other features and processes may also be included. For example, testingstructures may be included to aid in the verification testing of the 3Dpackaging or 3DIC devices. The testing structures may include, forexample, test pads formed in a redistribution layer or on a substratethat allows the testing of the 3D packaging or 3DIC, the use of probesand/or probe cards, and the like. The verification testing may beperformed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

Due to varying coefficients of thermal expansion (CIEs) of differentelements in a semiconductor package, the semiconductor package may bowupward or downward. Such bowing or warpage is not desirable for formingpackage on package (PoP) structure, because warpage could causemetal/dielectric interfacial delamination and thus affect reliability ofconnections between components. In addition, warpage of thesemiconductor package could break portions of RDLs to degrade yield.

Furthermore, warpage of the semiconductor package creates not onlydefects as mentioned above, but also handling issues duringmanufacturing. Warpage of a semiconductor package is related to a ratiobetween the die (mainly including Si) and the molding compound. Warpageis also related to a ratio between the die and the whole package, thatis the fan-out ratio. For semiconductor packages of different fan-outratios, it needs to collocate different carrier substrates includingdifferent CTEs for in-line warpage control. For example, a carriersubstrate including a CTE of about 9 ppm/° C. is required when thefan-out ratio is about 2.5, a carrier substrate including a CTE of about7 ppm/° C. is required when the fan-out ratio is about 2, and anothercarrier substrate including a CTE of about 5 ppm/° C. is required whenthe fan-out ratio is about 1. It is found that semiconductor packages ofdifferent fan-out ratios require carrier substrates of different CTEs,and thus cause low usage rate for the carrier substrates, and increaseidle time for the carrier substrates. Additionally, semiconductorpackage in large size is more likely subject to warpage defects.Therefore, it is desirable to reduce warpage during manufacturing of thesemiconductor package.

One or more implementations of the present invention will now bedescribed with reference to the attached drawings, Wherein likereference numerals are used to refer to like elements throughout, andwherein the illustrated structures are not necessarily drawn to scale.As used herein, the terms “die” and “chip” are interchangeablethroughout the specification.

Referring to FIG. 1, which is a schematic cross sectional view of asemiconductor structure according to aspects of the present disclosure.A semiconductor package 100 is provided. The semiconductor package 100includes a die 110 including a first surface 112 a and a second surface112 b opposite to the first surface 112 a. The semiconductor package 100further includes an adhesive film 130 disposed over the second surface112 b of the die 110 and a polymeric film 120 sandwiched between theadhesive film 130 and the die 110. The semiconductor package 100 furtherincludes a molding compound 140 surrounding the die 110, the polymericfilm 120 and the adhesive film 130. In some embodiments of the presentdisclosure, the die 110 can be a logic die, a central processing unit(CPU) die, a memory die, or the like. The die 110 can include integratedcircuit devices such as transistors, capacitors, inductors, resistors,and the like formed in a semiconductor substrate such as a Si substrateor over the first surface 112 a. Generally, a CTE of the die 110 isreferred to the CTE of Si, that is about 2.6 ppm/° C. Furthermore, aconnecting structure 114 can be formed over the first surface 112 a ofthe die 110. The connecting structure 114 includes at least onedielectric layer and at least one conductive lines formed therein. Insome embodiments, the conductive line is a die pad.

In some embodiments of the present disclosure, the adhesive film 130 canbe a die attach film (DAF), and can be suitable adhesive such asultraviolet (UV) glue, which loses its adhesive property when exposed toUV lights. Other types of adhesives may also be used, such as adhesivesthat lose some adhesive properties when exposed to heat. The adhesivefilm 130 includes a CTE, and the CTE of the adhesive film 130 can beabout 120 ppm/° C., but not limited to this. In some embodiments, theCTE of the adhesive film 130 is about 250 ppm/° C. In some embodiments,the adhesive film 130 is surrounded by the molding compound 140. In someembodiments, the adhesive film 130 is at least partially exposed fromthe molding compound 140. In some embodiments, a surface of the adhesivefilm 130 is exposed from the molding compound 140.

In some embodiments, the polymeric film 120 is configured to controlwarpage of the semiconductor structure 100. In some embodiments, thepolymeric film 120 is a warpage adjustable film. In some embodiments,the polymeric film 120 is disposed over the die 110 and surrounded bythe molding compound 140. In some embodiments, the polymeric film 120entirely covers the second surface 112 b of the die 110. In someembodiments, the polymeric film 120 is entirely covered by the adhesivefilm 130. In some embodiments of the present disclosure, a thickness ofthe polymeric film 120 is ranged from about 20 micrometers (μm) to about100 μm. And in other embodiments of the present disclosure, thethickness of the polymeric film 120 is ranged from about 20 μm to about60 μm. In some embodiments of the present disclosure, a CTE of thepolymeric film 120 is between the CTE of the adhesive film 130 and theCTE of the die 110. Therefore in some embodiment of the presentdisclosure, the CTE of the polymeric film 120 is between 2.6 ppm/° C.and 120 ppm/° C., but not limited to this. In some embodiments, a CTE ofthe polymeric film 120 is ranged from about a CTE at the temperatureless than the glass transition temperature (Tg) (CTE1) to about a CTE atthe temperature of the Tg or more (CTE2). For example, a CTE of thepolymeric film 120 is ranged from about 15 ppm/° C. (CTE1) to about 57ppm/° C. (CTE2), but not limited to this. In some embodiments of thepresent disclosure, the polymeric film 120 can include a polymer-basedmaterial with fillers such as epoxy resin with filler, orphenol resinwith filler, or other material having similar insulating and structuralproperties. As shown in FIG. 1, an interface 122 between the adhesivefilm 130 and the polymeric film 120, which laterally extends over thesecond surface 112 b of the die 110 and substantially perpendicular to asidewall of the polymeric film 120 and a sidewall of the adhesive film130, is surrounded by the molding compound 140. In some embodiments, theinterface 122 is substantially parallel to the second surface 112 b ofthe die 110.

The molding compound 140 is applied to protect the die 110 and providemechanical stiffness and enhance the mechanical strength of thesemiconductor package 100. The molding compound 140 may include anysuitable material such as an epoxy resin, a molding underfill, or thelike. The molding compound may include a CTE in a range of about 9-41ppm/° C. In some embodiments of the present disclosure, the CTE of thepolymeric film 120 is closer to the CTE of the molding compound 140 thanto the CTE of the die 110. In some embodiments of the presentdisclosure, the CTE of the polymeric film 120 is also closer to the CTEof the molding compound 140 than and to the CTE of the adhesive film130. For example, the CTE value was considered to have reliability up toglass transition (Tg) temperature. The CIE of the polymeric film 120 isabout 15 ppm/° C. below its Tg temperature, which is about 113° C. It iscloser to the CTE of the molding compound 140, which is about 9 ppm/° C.below its Tg temperature, than to the CTE of the die 110, which is about2.6 ppm/° C. The CTE of the polymeric film 120 is also closer to the CTEof the molding compound 140 than to the CTE of the adhesive film 130,which is about 120 ppm/° C. below its Tg temperature. As mentionedabove, the polymeric film 120 can include a polymer-based material withfillers. In some embodiments of the present disclosure, thepolymeric-based material can include materials the same with those usedin the adhesive film 130. However, by adding the fillers into thepolymeric-based material, characteristics such as the CTE of thepolymeric film 120 is adjusted to be closer to the CTE of the moldingcompound 140. Therefore, the polymeric film 120 makes the warpagebehavior more like the molding compound and is referred to as a warpageadjustable portion. Accordingly, in some embodiments of the presentdisclosure, a warpage control unit 135 including the warpage adjustableportion 120 and the adhesive portion 130 is provided.

In some embodiments of the present disclosure, the semiconductor package100 includes a plurality of through vias 104 in the molding compound140. The through vias 104 may be formed of any suitable conductivematerial, including copper (Cu), silver (Ag), nickel (Ni), platinum(Pt), aluminum (Al), lead-free solder (e.g., SnAg, SnCu, SnAgCu),combination thereof, or the like. As shown in FIG. 1, each of thethrough vias 140 extended through the molding compound 140 includes afirst end 106 a and a second end 106 b opposite to the first end 106 a.The first end 106 a and the second end 106 b are exposed from themolding compound 140, thereby allowing electrical connections to be madeto the through vias 104.

The semiconductor package 100 further includes at least an interconnectstructure 150. The interconnect structure 150 is formed over the firstsurface 112 a of the die 110 and the molding compound 140. Theinterconnect structure 150 can include one or more redistribution layers(RDLs), and the RDL can include a layer of a dielectric layer havingconductive lines formed therein. The dielectric layer can include, forexample but not limited to, a polymer material, such as epoxy,polyimide, polybenzoxazole (PBC)), and the like, or can be formed ofcommonly known dielectric materials, such as spin-on glass, siliconoxide (SiO), silicon oxynitride (SiON), or the like. The conductivelines can include a metal such as Cu, Ag, Al, Ni, combination thereof,or the like. The interconnect structure 150 is electrically coupled tothe die 110 through the connecting structure 114. And the interconnectstructure 150 is electrically coupled to the first end 106 a of thethrough vias 104 as shown in FIG. 1.

The semiconductor package 100 further includes a plurality of electricalconductors 170 disposed over and electrically coupled to theinterconnect structure 150. The electrical conductors 170 are solderballs, metal pads, metal pillars, and/or combination thereof, and may beformed of Au, Ag, Ni, W, Al, and/or alloys thereof. Additionally, anunder-ball metallurgy (UBM) (not shown) can be formed between theinterconnect structure 150 and the electrical conductors 170. Generally,the UBM is a conductive pad formed upon the interconnect structure 150and upon which the electrical conductors 170 are placed. In someembodiments of the present disclosure, a package component 160 includingpassive devices, which may include resistors, capacitors, inductors,and/or the like can be disposed over and electrically coupled to theinterconnect structure 150 as shown in FIG. 1.

FIG. 2 is a flow chart representing a method for manufacturing asemiconductor package according to aspects of the present disclosure inone embodiment. The method for manufacturing the semiconductor package20 includes an operation 202, providing a die including a first surfaceand a second surface opposite to the first surface. The method formanufacturing the semiconductor package 20 further includes an operation204, disposing a polymeric film over the second surface of the die. Themethod for manufacturing the semiconductor package 20 further includesan operation 206, providing an adhesive film. The method ofmanufacturing the semiconductor structure for the memory device 20further includes an operation 208, attaching the die and the polymericfilm to a carrier substrate through the adhesive film. The method ofmanufacturing the semiconductor structure for the memory device 20further includes an operation 210, molding the die, the polymeric filmand the adhesive film with a molding compound. The method formanufacturing the semiconductor package 20 is further describedaccording to one or more embodiments.

FIGS. 3A through 3G illustrate sectional views of a semiconductorpackage 100 at various fabrication stages constructed according toaspects of the present disclosure in some embodiments.

Referring to FIG. 3A, a carrier substrate 102 is provided. Generally,the carrier substrate 102 provides temporary mechanical and structuralsupport during subsequent processing steps, such as those described indetail below. The carrier substrate 102 may be formed of any suitablematerials including, for example but not limited to, glass, siliconoxide, aluminum oxide, a combination thereof, and/or the like.

In some embodiments of the present disclosure, some conductive posts 104are formed on the carrier substrate 102. The conductive posts 204 can beformed by, for example but not limited to, the following operations: Apatterned mask (not shown) can be formed on the carrier substrate 102 todefine the shape and locations of the conductive posts 104 through amolding compound, which will be further described in the following,thereby providing an electrical connection between two opposite sides ofthe package. The patterned mask may be a patterned photoresist mask, apatterned hard mask, a combination thereof, or the like. The conductiveposts 104 may be formed through any number of suitable techniques,including electroplating, physical vapor deposition (PVD), chemicalvapor deposition (CVD), electrochemical deposition (ECD), molecular beamepitaxy (MBE), atomic layer deposition (ALD), and the like. It should benoted that in some embodiments, such as those that deposit a conformallayer over the entire surface of the wafer (e.g., PVD and CVD), it maybe desirable to perform an etching or planarization operation (e.g.,chemical mechanical polishing (CMP)) to remove excess conductivematerial from the surface of the patterned mask.

The patterned mask is then removed. In some embodiments the patternedmask is formed from photoresist materials, and the patterned photoresistmask may be stripped by, for example but not limited to, a chemicalsolution such as a mixture of ethyl lactate, anisole, methyl butylacetate, amyl acetate, cresol novolak resin, and diazo photoactivecompound (referred to as SPR9), or another stripping process. In someembodiments the patterned photoresist mask may be stripped using amixture of a solvent (e.g., dimethyl sulfoxide (DMSO)), an alkaline(e.g., potassium hydroxide KOH or tetramethylammonium hydroxide (TMAH),and a surfactant additive.

Referring to FIG. 3B, at least one die 110 is provided according tooperation 202. The die 110 includes a first surface 112 a and a secondsurface 112 b opposite to the first surface 112 a. A connectingstructure 114 can be formed over the first surface 112 a of the die 110.As mentioned above, the connecting structure 114 includes at least onedielectric layer and conductive lines formed therein. In someembodiments, the conductive line is a die pad.

Still referring to FIG. 3B, a polymeric film 120 is disposed over thesecond surface 112 b of the die 110 according to operation 204. Thepolymeric film 120 may be applied via lamination, spin coating, or othersuitable techniques. As shown in FIG. 3B, the second surface 112 b ofthe die 110 is entirely covered by the polymeric film 120.

Referring to FIG. 3C, an adhesive film 130 is formed over the polymericfilm 120 and over the second surface 112 b of the die 110 according tooperation 206. Accordingly, the polymeric film 120 is sandwiched betweenthe adhesive film 130 and the die 110 as shown in FIG. 3C. In someembodiments of the present disclosure, the adhesive film 130 can beapplied via lamination, spin coating, or other suitable technique.

Referring to FIG. 3D, the die 110 and the polymeric film 120 are thenattached to the carrier substrate 102 through the adhesive film 130according to operation 208. As shown in FIG. 3D, the polymeric film 120is sandwiched between the adhesive film 130 and the die 110 uponattaching to the carrier substrate 102.

Referring to FIG. 3E, the die 110, the polymeric film 120, the adhesivefilm 130, and the conductive posts 104 are molded with a moldingcompound 140 according to the operation 210. As shown in FIG. 3E, themolding compound 140 surrounds the die 110, the polymeric film 120 andthe adhesive film 130. Also, an interface 122 between the adhesive film120 and the polymeric film 130, which laterally extends over the secondsurface 112 b of the die 110 and substantially perpendicular to asidewall of the polymeric film 130 and a sidewall of the adhesive film120, is surrounded by the molding compound 140. The molding compound 140is applied to protect the die 110 and provide mechanical stiffness andenhance the mechanical strength of the semiconductor package 100.Suitable methods for forming the molding compound 140 may includecompressive molding, transfer molding, liquid encapsulant molding, orthe like. For example, the molding compound 140 may be dispensed betweenthe die 110 and the conductive posts 104 in liquid form. Subsequently, acuring process is performed to solidify molding compound 140. Thefilling of the molding compound 140 may overflow over the die 110 sothat the molding compound 140 covers a top surface of the die 110 andthe conductive posts 104. In some embodiments of the present disclosure,a thinning operation is therefore performed to expose a first end 106 aof each conductive post 140 to form through vias extended through themolding compound 140 and the top surface of the connecting structure140, thereby allowing electrical connections to be made to theconductive posts/through vias 104 such as discussed in detail below.

It should be understood that the warpage of the semiconductor package100 is related to a ratio between the die 110 (including Si) and themolding compound 140. The warpage is also related to a ratio between thedie 110 and the whole package, that is the fan-out ratio. Therefore, insome embodiments of the present disclosure, a portion of the die 110 isremoved, or, the die 110 is thinned from the second surface 112 b beforedisposing the polymeric film 120. And a thickness of the portion of thedie 110 being removed is substantially equal to a thickness of thepolymeric film 120. In some embodiments of the present disclosure, whenthe fan-out ratio is relative low, a thinner polymeric film 120 isrequired. And in some embodiments, when the fan-out ratio is relativehigh, more Si is removed from the die 110, and a thicker polymeric film120 is employed. The polymeric film 120 which includes the CTE closer tothe CTE of the molding compound 140 modifies the warpage behavior overthe area where the die 110 occupies. Consequently, warpage of thesemiconductor package 100 is reduced. In other words, by adjusting thethickness of the die to yield some space and by providing a polymericfilm with sufficient thickness to take up the space yielded from thedie, warpage of the semiconductor packages of different fan-out ratiosis reduced.

Additionally, for package of different fan-out ratios, it needs tocollocate different carrier substrate including different CIEs forin-line warpage control. For example, a carrier substrate including aCTE of about 8.8 ppm/° C. is required when the fan-out ratio is about2.32, and another carrier substrate including a CTE of about 5.1 ppm/°C. is required when the fan-out ratio is about 1.07. It is foundsemiconductor packages of different fan-out ratios require carriersubstrate of different CTE, and thus cause low usage rate for thecarrier substrates, and increase idle time in the prior art. Howeveraccording to the embodiments of the present disclosure, since thewarpage of the structure over the carrier substrate 102 is reduced bythe polymeric film 120, choice of the carrier substrate 102 can besimplified, usage rate of the carrier substrate 102 is improved, andidle time of the carrier substrate 102 is reduced.

Referring to FIG. 3F, an interconnect structure 150 is formed over thefirst surface 112 a of the die 110 and the molding compound 140. Theinterconnect structure 150 is electrically coupled to the die 110through the connecting structure 114. And the interconnect structure 150is electrically coupled to the first end 106 a of the through vias 104as shown in FIG. 3F.

Still referring to FIG. 3F, a plurality of electrical conductors 170 aredisposed over and electrically coupled to the interconnect structure150. In some embodiments of the present disclosure, a package component160 including passive devices, which may include resistors, capacitors,inductors, and/or the like can be disposed over and electrically coupledto the interconnect structure 150 as shown in FIG. 3F.

Referring to FIG. 3G, the semiconductor package 100 is de-bonded fromthe carrier substrate 102. In some embodiments of the presentdisclosure, the semiconductor package 100 is bonded to another substrate(not shown). Accordingly, a second end 106 b opposite to the first end106 a of each conductive post/through-via 104 is exposed from a surfaceof the molding compound 140. And a plurality of electrical conductors172 is formed over the molding compound 104 and electrically coupled tothe conductive posts/through vias 104 at the second end 106 b. Thuselectrical connections of a component such as another integrated circuitdie (not shown), which can be stacked on the semiconductor package 100,are constructed through the electrical conductors 172. Optionally, UBMmay be formed on the exposed second ends 106 b of the through vias 104prior to forming the electrical conductors 172.

Still referring to FIG. 3G, the carrier substrate (not shown) is thende-bonded, and the semiconductor package 100 is affixed to a packagesubstrate 180 such as a printed circuit board (PCB) or the like. Thesemiconductor package 100 is electrically coupled to the packagesubstrate 180 through the electrical conductors 170 and the interconnectstructure 150.

In the present disclosure, the polymeric film, that is the warpageadjustable film, is provided to cover the entire second surface of thedie. The CTE of the warpage adjustable film is between the CTE of thedie attach film and the die. Furthermore, the CTE of the warpageadjustable film is closer to the CTE of the molding compound than to theCTE of the die and the CTE of the die attach film. The warpageadjustable film over the second surface of the die makes the warpagebehavior in this region more like the molding compound than the die,therefore the warpage of the whole semiconductor package is reduced.That is, a more flat semiconductor package is obtained, which in turnreduced poor jointing during die assembly. Furthermore, since thewarpage is reduced, choice of the carrier substrate can be simplifiedand thus usage rate of the carrier substrate is improved and idle timeof the carrier substrate is reduced.

In some embodiments, a method for manufacturing a semiconductor packageis provided. The method includes following operations. A die having afirst surface and a second surface opposite to the first surface isprovided. A polymeric film is disposed over the second surface of thedie. An adhesive film is provided. The die and the polymeric film areattached to a carrier substrate through the adhesive film. The die, thepolymeric film and the adhesive film are molded with a molding compound.In some embodiments, the polymeric film is sandwiched between the dieand the adhesive film upon attaching to the carrier substrate.

In some embodiments, a method for manufacturing a semiconductor packageis provided. The method includes following operations. A die having afirst surface and a second surface opposite to the first surface isprovided. In some embodiments, a connecting structure is disposed overthe first surface of the die. A warpage control unit is formed over thesecond surface of the die. The die and the warpage control unit areattached to a carrier substrate. In some embodiments, the carriersubstrate includes at least a conductive post. The die, the warpagecontrol unit and the conductive post are molded with a molding compound.The molding compound has a first surface facing the carrier substrate,and a second surface opposite to the first surface. The conductive posthas a first surface facing the carrier substrate, and a second surfaceopposite to the first surface. In some embodiments, the second surfaceof the conductive post, the second surface of the molding compound and asurface of the connecting structure are aligned with each other.

In some embodiments, a method for manufacturing a semiconductor packageis provided. The method includes following operations. A die having afirst surface and a second surface opposite to the first surface isprovided. A warpage control unit is disposed over the second surface ofthe die. The die and the warpage control unit are attached to a carriersubstrate. The die and the warpage control unit are molded with amolding compound. An interconnect structure is formed over the firstsurface of the die and the molding compound. The warpage control unitincludes a polymeric film and an adhesive film. In some embodiments, thepolymeric portion is between the second surface of the die and theadhesive portion.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing a semiconductorpackage, comprising: providing a die comprising a first surface and asecond surface opposite to the first surface; disposing a polymeric filmover the second surface of the die; providing an adhesive film;attaching the die and the polymeric film to a carrier substrate throughthe adhesive film; and molding the die, the polymeric film and theadhesive film with a molding compound, wherein the polymeric film issandwiched between the die and the adhesive film upon attaching to thecarrier substrate, and sidewalls of the polymeric film and sidewalls ofthe adhesive film are in contact with the molding compound.
 2. Themethod of claim 1, further comprising removing a portion of the die fromthe second surface before disposing the polymeric film.
 3. The method ofclaim 2, wherein a thickness of the portion of the die being removed issubstantially equal to a thickness of the polymeric film.
 4. The methodof claim 1, wherein the die comprises a first coefficient of thermalexpansion (CTE), the polymeric film comprises a second CTE, the adhesivefilm comprises a third CTE, and the second CTE of the polymeric film isbetween the first CTE of the die and the third CTE of the adhesive film.5. The method of claim 4, wherein the molding compound comprises afourth CTE, and the second CTE of the polymeric film is closer to thefourth CTE of the molding compound than to the first CTE of the die andto the third CTE of the adhesive film.
 6. The method of claim 1, whereinthe adhesive film has a first surface facing the die and a secondsurface opposite to the first surface, and the second surface of theadhesive film aligns with a surface of the molding compound.
 7. A methodfor manufacturing a semiconductor package, comprising: providing a diecomprising a first surface and a second surface opposite to the firstsurface, wherein a connecting structure is disposed over the firstsurface of the die; forming a warpage control unit over the secondsurface of the die; attaching the die and the warpage control unit to acarrier substrate comprising at least a conductive post; and molding thedie, the warpage control unit and the conductive post with a moldingcompound, wherein the molding compound has a first surface facing thecarrier substrate and a second surface opposite to the first surface,the conductive post has a first surface facing the carrier substrate anda second surface opposite to the first surface, and the second surfaceof the conductive post, the second surface of the molding compound and asurface of the connecting structure are aligned with each other, a widthof the connecting structure is equal to a width of the die, andsidewalls of the connecting structure are in contact with the moldingcompound.
 8. The method of claim 7, wherein the forming of the warpagecontrol unit further comprises: forming a warpage adjustable portionover the second surface of the die; and forming an adhesive portion overthe warpage adjustable portion.
 9. The method of claim 8, wherein thedie and the warpage adjustable portion are attached to the carriersubstrate through the adhesive portion.
 10. The method of claim 8,further comprising removing a portion of the die from the second surfacebefore the forming of the warpage adjustable portion.
 11. The method ofclaim 10, wherein a thickness of the portion of the die being removed issubstantially equal to a thickness of the warpage adjustable portion.12. The method of claim 8, wherein the adhesive portion has a firstsurface facing the die and a second surface opposite to the firstsurface, and the second surface of the adhesive portion is aligned withthe first surface of the conductive post and the first surface of themolding.
 13. The method of claim 8, wherein the die comprises a firstcoefficient of thermal expansion (CTE), the warpage adjustable portioncomprises a second CTE, the adhesive portion comprises a third CTE, andthe second CTE of the warpage adjustable portion is between the firstCTE of the die and the third CTE of the adhesive portion.
 14. The methodof claim 13, wherein the molding compound comprises a fourth CTE, andthe second CTE of the warpage adjustable portion is closer to the fourthCTE of the molding compound than to the first CTE of the die and to thethird CTE of the adhesive portion.
 15. A method for manufacturing asemiconductor package, comprising: providing a die comprising a firstsurface and a second surface opposite to the first surface; disposing awarpage control unit over the second surface of the die; attaching thedie and the warpage control unit to a carrier substrate; molding the dieand the warpage control unit with a molding compound; and forming aninterconnect structure over the first surface of the die and the moldingcompound, wherein the warpage control unit comprises a polymeric filmand an adhesive film, and the polymeric film is between the secondsurface of the die and the adhesive film.
 16. The method of claim 15,further comprising: forming a first electrical conductor over theinterconnect structure; and removing the carrier substrate.
 17. Themethod of claim 16, further comprising forming a conductive post overthe carrier substrate before the attaching of the die and the warpagecontrol unit to the carrier substrate.
 18. The method of claim 17,wherein the conductive post has a first end electrically connected tothe interconnect structure and a second end opposite to the first end.19. The method of claim 18, further comprising forming a secondelectrical conductor over and electrically connected to the second endof the conductive post after the removing of the carrier substrate. 20.The method of claim 16, further comprising attaching the interconnectstructure to a package substrate through the first electrical conductor.